A recent report suggests that the Chinese brand Redmi is preparing to launch the Redmi 9 phone during the first quarter of 2020. It is noted that the phone may use the new Helio G70 chip.
Judging by the label, it is possible that it is a chipset with a slightly weaker configuration than the Helio G90T model, which powers the Redmi Note 8 Pro, reports PlayfulDroid.
The leaker from China has now published key details about the Helio G70 chipset. According to information, the Helio G70 is a low-end processor. It has two Cortex A75 cores @ 2.0GHz and six Cortex A55 cores @ 1.7GHz, while there is Mali-G52-MC2 GPU. When it comes to performance, the chipset may be weaker than the MediaTek Helio P65 processor.
The Helio G70 chipset in the Redmi 9 phone would have to be paired with 4GB of RAM. There will also be several other RAM and storage options, KOHA Ditore writes. The phone will have a 6.6-inch screen, with a dot-shaped notch. This suggests that the phone will be bigger than its predecessor - the Redmi 8.
Redmi 9 will be launched in China first, and then it is expected in India and other global markets.
